Automated X-ray Inspection (AXI) - Topscom Technology

https://www.topscompcbassembly.com/en/Electronics-Pcb-assembly-oem-manufacturing-china-supplier-manufacturer/

Increasing product complexity and component miniaturization have driven the need for more consistent inspection processes and alternative test methods. Topscom has responded to this need in several ways, including the addition of Automated X-ray Inspection (AXI) to our capabilities. AXI is designed to find structural solder faults including solder opens, shorts, insufficient solder, excessive solder, missing electrical parts, and mis-aligned components. This includes non-visible joints such as area-array packages (BGA, CSP, Flip Chip), parts under RF shielding, and some connector styles. Defects are rapidly detected and repaired with almost no debug time. https://is.gd/K6iFAW 

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